Samsung is steadily working towards its goal of creating 1000-layer NAND Flash storage modules. However, as manufacturing complexities increase, the company cannot achieve this with a single chip. Instead, it is turning to advanced packaging solutions to stack two 450-layer V-NAND modules into a single 900-layer V-NAND chip. According to ET News, which first reported this manufacturing achievement, Samsung is using Cell Multi-Bonding (CMB) technology, a variant of wafer stacking achieved through hybrid bonding. This process forms a permanent bond between two silicon chips using embedded metal bumps that are fused together to create a single chip. Multiple dies, or in Samsung's case, multiple whole silicon wafers, can be connected by stacking two chip back ends together. Samsung's proprietary process, called CMB, paves the way for 1000-layer V-NAND chips by 2030.